Piratla Uma Sathyakam and Partha S. Mallick* Pages 76 - 80 ( 5 )
Background: Crosstalk will be a major concern in future nano ICs where the components will be scaled down to a few nanometers. In particular, modeling of CNT based interconnects shows that they will suffer from crosstalk when fabricated at smaller technology nodes.
Objective: This paper presents reduction of crosstalk and noise in CNT bundle interconnects. We propose the use of small diameter semiconducting CNTs (s-CNTs) as electromagnetic interference (EMI) shields for CNT bundle interconnects.
Methods: The coupling capacitance of the proposed CNT bundle structure shows that crosstalk can be reduced significantly by using small diameter s-CNTs. We perform SPICE analysis to show the reduction in crosstalk and peak noise.
Results: The proposed bundle geometry reduces 46% crosstalk induced delay and 23% output peak noise as compared to conventional CNT interconnects.
Conclusions: Small diameter semiconducting CNTs can be used as EMI shields to reduce crosstalk and noise in CNT interconnects.
Carbon nanotubes, interconnects, crosstalk, delay, peak noise, integrated circuits.
School of Electrical Engineering, VIT University, Vellore, Tamil Nadu 632014, School of Electrical Engineering, VIT University, Vellore, Tamil Nadu 632014